Solderability Improvements for Drag Soldered PWBs. Final Report

机译：拖曳焊接pWB的可焊性改进。总结报告

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摘要

The causes of solderability problems on drag soldered printed wiring boards (PWBs) were investigated. Excessive removal of tin-lead from the PWB surface was found to be the major cause. A solder leveling method was incorporated to control the consistency of the tin-lead removal process. (ERA citation 07:004951)

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作者
Trent, M. A.;
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作者单位

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年度 1981
页码 p.1-12
总页数 12
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Printed circuits; Fabrication; Lead; Quality control; Removal; Soldering; Tin;

机译：印刷电路;制造;铅;质量控制;去除;焊接;锡;

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2. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [J] . Jaharah A. Ghani, Javier Narciso, Mohd Nizam Ab. Rahman, Materials . 2014,第12期

机译：锡膏合金的可靠性研究，以改善表面安装细间距元件的焊点
3. Drag Soldering: The Best Way to Touchup and Rework High Pin Count SMDs [J] . BOB DOETZER, BUBBA POWERS Global SMT & Packaging: European Edition (Surface Mount Technology) . 2020,第7期

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4. BGA SOLDER VOID CORRELATION TO VIA-IN-PAD, VIA FILL, SURFACE FINISH, AND LEAD-FREE SOLDER –FINAL REPORT [C] . Chrys Shea, Rahul Raut, Lou Picchione, Annual Pan Pacific Microelectronics Symposium Tabletop Exhibition . 2007

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5. Development of cost-based inspection plans for solder paste print deposition and process improvement for a surface mount assembly line. [D] . Nayak, Gautam Nandkishore. 2011

机译：为焊膏印刷沉积制定基于成本的检查计划，并改善表面安装组装线的工艺。
6. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014

机译：锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
7. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014

机译：焊膏合金改善表面贴装细间距焊点焊缝的可靠性研究
8. Drag Soldering Process Control. Final Report [R] . Douglass, R. C., Trent, M. A. 1985

机译：拖动焊接过程控制。总结报告

Solderability Improvements for Drag Soldered PWBs. Final Report

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