Evaluation of Semiconductor Chips for Bendix-Built Hybrid Microcircuits. Final Report

摘要

A process was established by which a representative cross section of the military-grade integrated circuit (IC) chips, procured from commercial suppliers for use in the production of telemetry hybrid microcircuits (HMCs), could be qualitatively assessed. This was accomplished by first packaging 10 representative groups of ICs using processes and tooling adapted from existing production applications. The groups were then preconditioned and electrically tested using existing product specifications, hardware, and software. These tasks were performed to determine the reliability of the published electrical characteristics of the devices at temperature extremes and through preconditioning. No formal acceptance testing is performed on the semiconductor chips procured for the telemetry HMCs at the component level. (ERA citation 07:061900)