Optically Assisted Three Dimensional Packaging for Multichip Module Applications

摘要

This report presents a board-to-board optical interconnect system for 3-Dpackaging of multichip module applications. The interconnect prototype demonstrates both waveguide-backplane-fiber interconnects and fiber ribbon interconnects for interboard applications. On the fiber-ribbon-based board-to-board interconnects, distributed feedback laser arrays are used as signal transmitters. PIN type photodetector arrays are used for optical-to-electrical signal conversion at the receiver board. On the waveguide-backplane-fiber interconnects, channel waveguide electrooptic modulator arrays were used as signal transmitters that convert chip electrical signals to optical signals. These devices will potentially have a much lower cost and will operate at a much higher speed for use in computing systems and other high-speed electronic instruments such as signal generators, oscilloscopes, signal amplifiers, and transceiver modules.