Micro Heat Exchanger Using Impinging Jets and Vacuum-Insulated Skin

摘要

The goal of this work was to study micro impinging jet cooling, focusing on experimentation with variable parameters of height, nozzle diameter, and nozzle spacing in the submillimeter range. The objective of this project is to obtain a set of design rules that can be used to develop an efficient and economical heat exchanger that will meet present and future integrated circuit microchip cooling requirements. The two factors which largely determine the efficiency of a heat exchanger in this situation is (1) its ability to transfer heat from the chip surface to a transport medium, usually air, and (2) this medium's capacity to convect the heated fluid away from the chip. Our proposed solution was to develop and characterize a micro jet impingement cooling system. A high speed cool gas directly impinges on the hot surface through MEMS nozzle/ slot array, and penetrates deep into the boundary layer to form a sharp temperature gradient. About one nozzle length downstream, the coherent structures in the jets induce an unsteady separation which has a strong upward motion to carry the heat away from the surface.