Radiation Hardened Low Power Digital Signal Processor

摘要

Report developed under SBIR contract for topic AF04-020. This program develops a unique digital signal processing chip architecture based around four on-chip elements; a large multi-use memory, a RISC microprocessor, a fast FFT based vector processor, and a re-configurable Field Programmable Gate Array (FPGA). These four elements are synchronized and blended on-chip to form a powerful signal and image processor. This processor, called the Transform Concentric Signal Processor (TCSP), meets and exceeds many of the current DoD on-board processing requirements. Scalability is a major strength of the TCSP, multiple TCSP chips can be cascaded on a board, or in an MCM, to efficiently address even the most demanding signal and image processing requirements. A significant windfall of this approach is a substantial reduction in software Engineering due to the TCSP's advanced data flow, ultra low latency, and high radix techniques.