Liquid Cooler Module with Carbon Foam for Electronics Cooling Applications (Preprint); Journal article

摘要

A liquid cooler module (LCM) employing a high thermal-conductivity, pitch-based carbon foam is studied. The newly developed carbon foam has an effective conductivity up to 150 W/m-K and porosity up to 90%. It is believed that this high-conductivity carbon foam could significantly enhance the heat transfer due to the thermal dispersion effect. To prove the concept of the carbon foam liquid cooler, a three-dimensional numerical study of the carbon foam cooler was undertaken. The numerical results indicated that even with a heat flux as high as 100 W/cm2, the average temperature drop between the substrate and the liquid coolant is less than 20 degrees C. Experimental study was also undertaken for the LCM and the results were compared with the numerical results.