Dislocation Dynamic Modeling in High Temperature Single Crystal Viscoplasticity (Preprint)

摘要

We have developed a crystallographic-based viscoplastic model for nonisothermal high temperature deformation and coupled it with damage kinetics. Several damage mechanisms, namely the multiplication of mobile dislocations, void growth and including scale effects, caused by dislocation extrusions/intrusions, have been considered. We applied two body interaction concepts from chemical kinetics to include in our constitutive relations the generation and interaction of pinned and mobile dislocations. The relative importance of each of the damage modes at different temperatures and stress levels has been deduced by comparing strain-stress and crystallographic texture predictions calibration against test data and has shown that the dislocation density growth may be important in characterizing primary creep.