In the period covered by this report all investigations of the preliminary research and development phase of the contract have been completed.nA technique for plating of copper in plated through holes less than .025" in diameter and more than two diameters deep has been developed. This technique consists of partial panel and partial pattern plating of the copper. Boards manufactured by this technique exhibited minimum plating buildup and minimum of undercut around the miniature plated through holes with a .002" rim around the periphery. Better control of plating currents has also been achieved.
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