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RANDOM VIBRATION STUDIES OF COUPLED STRUCTURES IN ELECTRONIC EQUIPMENTS

机译:电子设备耦合结构的随机振动研究

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The previous report ASD-TDR-63-205 and the present one study two main areas: the replacement of acoustic excitation by direct mechanical excita¬tion and the response of substructures tied to a randomly vibrating primary structure.nThis report presents techniques of measurement of power flow from a shaker to a structure, a detail analysis of the case of edge connections, the results of mechanical simulation of an acoustic test applied to a model electronic package, and a discussion of acoustic and vibration tests per¬formed on an Atlas Guidance Computer.nPublication of this technical documentary report does not constitute Air Force approval of the report's findings or conclusions. It is published only for the exchange and stimulation of ideas.

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