Lead Attachment and Encapsulation Techniques for Thin Film Microcircuits

摘要

The techniques described were developed for encapsulating experimental thin film circuits deposited on 0.5-inch square glass substrates. The encapsulation is epoxy, with final package dimensions of 0.6-inch square x .125-inch thick. Up to 32 ribbon leads emerge, on .050 centers, arranged on the periphery of the package. A factor complicating the encapsulation was the requirement that the leads emerge on the four edges of the unit. A molding process using silicone rubber molds, and a hypodermic filling arrangement was evolved. (Author)