LOW-LOSS STYRENE-TYPE FOAM-IN-PLACE ENCAPSULATING RESINS

摘要

Low-dielectric-loss styrene-type foam-in-place encapsula-ting resins are not available commercially. Such a resin has now been developed in these Laboratories. A propellant was added to the catalyzed styrene-polystyrene mixture;as the temperature of the polymerizing resin rose, the propellant expanded the resin into a cellular structure. Homogeneous foams were obtained in the presence of finely powdered polymers, which acted as bubble nucleators.