Fatigue Crack Propagation in Copper and Copper-Aluminum Single Crystals No. 2

摘要

The effect of crystallographic orientation, temperature and stacking fault energy on the rate of fatigue crack propagation was studied in polycrystalline copper, copper single crystals and copper-aluminum single crystals at room temperature and at liquid nitrogen temperature. A stress intensity factor was used to normalize the crack propagation data. It was found that dislocation cross slip plays a critical role on the rate of fatigue crack propagation. Existing mathematical crack propagation formulae could not explain the data on single crystals. A new fatigue crack propagation model to explain the observed results is proposed. (Author)