Fatigue Crack Propagation in Copper and Copper-Aluminum Single Crystals

摘要

The effects of crystallographic orientation, temperature and stacking fault energy on the rate of fatigue crack propagation have been studied in polycrystalline copper, copper single crystals and copper-aluminum single crystals at room temperature and at liquid nitrogen temperature. The results were discussed in terms of cyclic hardening and the case of dislocation cross slip. (Author)