An Investigation of Gold Films Condensed on Alumina Substrates in Low Pressure Oxygen.

摘要

An investigation is described in which gold was evaporated directly on to alumina in the presence of oxygen. The purpose of the investigation was to observe any enhancement of adhesion and to determine the suitability of the system for microstrip transmission lines. Increased adhesion was observed and was traced to the interaction of the tungsten heater with oxygen. Further processing to fabricate microstrip lines revealed the adhesion subject to chemical attack. (Author)