首页> 美国政府科技报告 >Slow Crack Growth and Failure Prediction of Brittle Materials Subjected to a Transient Thermal Stress.
【24h】

Slow Crack Growth and Failure Prediction of Brittle Materials Subjected to a Transient Thermal Stress.

机译:脆性材料在瞬态热应力作用下的缓慢裂纹扩展和失效预测。

获取原文

摘要

The effect of slow crack growth on the failure conditions of a brittle material subjected to a transient thermal stress in a stress-corrosive environment was investigated. A numerical analysis procedure was developed for calculating the instantaneous values for crack length and transient stress intensity factors of a glass rod subjected to a sudden decrease in ambient temperature under convective heat transfer conditions. The analysis demonstrated that slow crack growth significantly decreases the thermal conditions required for catastrophic failure. A form of crack growth instability is predicted at values of the stress intensity factor well below K sub IC, where the rate of increase of stress intensity factor is such that catastrophic failure becomes inevitable. (Author)

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号