Standardization Engineering Practices Study for Printed Wiring Board and Assembly Defects Guide and Conformal Coatings Problem Areas.

摘要

The purpose of this program was to develop a military standard that contained corrective action guide data for printed wiring board and assembly defects and to develop test data from which revision drafts to MIL-I-46058 could be written. This report describes the accomplishments of the final portion of the program. It also includes major portions of effort completed in previous semiannual portions of the program. The complete results of all contract goals are provided with emphasis placed on reversion, service temperature, and buffer material analysis. The Phase I portion is provided as an appendix to this report and sets forth those features necessary to achieve the goals selected. The Phase II effort demonstrated that a quantitative test procedure could be developed that would measure change in properties of the various materials as they age or deteriorate under thermal and moisture conditions. The buffer material tests strongly indicate the need for buffer materials only if coating thicknesses are greater than 6 mils. (Author)