Design Guidelines for Hybrid Microcircuits. Volume I. Beam Lead Study.

摘要

This report is a study of the bonding of beam-leaded chips onto several types of hybrid substrates, mostly with thick film metallization. Beam lead semiconductors of various sizes were bonded on monolayer substrates as well as multilayer substrates of increasing complexity. The integrity of the bonding on the various types of substrates changes and permits the author to draw design rules for hybrid circuits comprising beam-leaded chips. Report describes a non-destructive method to test the bonds of beam-leaded chips. (Author)