Lead frame for hybrid I. C package

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  机译： 用于半导体管芯封装的混合引线框架，具有改善的爬电距离

• 4. HYBRID LEAD FRAME FOR SEMICONDUCTOR DIE PACKAGE WITH IMPROVED CREEPAGE DISTANCE [P] . 美国专利： US2020203262A1 . 2020-06-25

  机译： 具有改善的爬电距离的半导体裸片封装混合铅框架

• 5. HYBRID LEAD FRAME FOR SEMICONDUCTOR DIE PACKAGE WITH IMPROVED CREEPAGE DISTANCE [P] . 美国专利： US20200203262A1 . 2020.06.25

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