Viscoelastic Polymer for Printed-Circuit-Board Vibration Damping

摘要

A viscoelastic polymer was selected as a possible means of vibration damping for electronic printed-circuit-board (PCB) assemblies in a surface-to-air guided-missile application. Thin layers of the self-adhesive polymer were bonded to dummy and real PCB assemblies, and accelerations were recorded at various PCB locations during sinusoidal vibration tests. For input levels of 1 and 2 g and logarithmic frequency sweeps from 10 to 2500 Hz, peak resonant acceleration levels were reduced to 15 percent of the peak levels recorded under the same conditions with no damping layers added. (Author)