Reliability Evaluation of Low Power Schottky Clamped Microcircuits

摘要

An evaluation study has been completed on T2L Schottky integrated circuits of medium to large scale integration. The study consisted of electrical and physical characterization, step stress and accelerated long term testing, failure analysis and failure rate determination. The objective of this study was to verify the suitability of these devices for incorporation in advanced digital military systems. Five device types were selected and each was procured from two manufacturers. Device selection was based upon the availability of the MIL-M-38510 slash sheet at the time of selection, and manufacturer selection was based upon his offering the greatest number of the devices selected. In all, in excess of 1000 devices from four different manufacturers were included in the study. Electrical characterization was accomplished on computer-based test systems augmented by bench testing of transfer characteristics and thermal resistance.