Electronic systems manufacturing: some aspects of plastic encapsulated microcircuits (PEM) and the evaluation of their reliability

摘要

The paper gives an overview of the present situation in the domain. After a short introduetion, thee main problems arisen in reliability predicition and evaluation of monolithic integrated circuits (ICs), the evaluation itself and some new points of view concerning the dynamic life testing, screening and burn-in, humidity environment, accelerated thermal tests, physics of failure of plastic encapsulated microcircuits (PEM) and reliability building are presented. Characterization techniques for Hg_(1-x)Cd_xTe epilayers are mentioned.