Direct Writing of Microstructures for Microelectronics

摘要

A program to investigate direct laser writing for semiconductor processing is described. In this program the following results were obtained: The first reported fabrication of submicrometer diffraction gratings in GaAs; Development of a new technique for writing patterns of the dielectric material, SiO2; Measurement of the conductivity and properties of metal interconnects; The first demonstration of laser-enhanced plasma etching; and The first observation of deep-UV enhanced liquid etching of GaAs.