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Ultrafast laser direct writing method for modifying the microstructure of the existing sub-micron scale

机译:用于修改现有亚微米刻度的微观结构的超快激光直接写入方法

摘要

A method for pre-calibration of a laser micro-machining system to achieve alignment tolerances greater than the diffraction limit of an illumination wavelength. A blank is mounted in the system, such that the beam spot is incident on its top surface. Two marks are ablated in the blank. The centers of the marks are a predetermined distance apart. The blank is illuminated with light and imaged with a digital camera. The resulting image is scaled such that each pixel has a width corresponding to a distance on the imaged surface, which is less than half of the illumination wavelength. The number of pixels between the centers of the marks determines this distance. The locations of the marks in the image are determined and a coordinate system is defined for surfaces imaged by the digital camera. Coordinates of the beam spot in this coordinate system are also determined using the second mark.
机译:一种用于激光微加工系统的预校准方法,以实现大于照明波长衍射极限的对准公差。将毛坯安装在系统中,以使束斑入射在其顶面上。空白处有两个标记。标记的中心相距预定距离。毛坯用光照明并用数码相机成像。缩放所得图像,以使每个像素的宽度对应于被成像表面上的距离,该距离小于照明波长的一半。标记中心之间的像素数确定该距离。确定图像中标记的位置,并为数码相机成像的表面定义坐标系。光束点在该坐标系中的坐标也使用第二个标记确定。

著录项

  • 公开/公告号JP2007527326A

    专利类型

  • 公开/公告日2007-09-27

    原文格式PDF

  • 申请/专利权人 松下電器産業株式会社;

    申请/专利号JP20070501864

  • 发明设计人 ミン リー;石塚 誠;

    申请日2005-02-25

  • 分类号B81C5/00;B23K26/02;B23K26/00;B23K26/36;B82B3/00;H01L21/302;

  • 国家 JP

  • 入库时间 2022-08-21 21:12:55

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