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Ultrafast laser direct writing method for modifying existing microstructures on a submicron scale

机译:超快激光直接写入方法,可在亚微米级上修饰现有的微结构

摘要

A method for pre-calibration of a laser micro-machining system to achieve alignment tolerances greater than the diffraction limit of an illumination wavelength. A blank is mounted in the system, such that the beam spot is incident on its top surface. Two marks are ablated in the blank. The centers of the marks are a predetermined distance apart. The blank is illuminated with light and imaged with a digital camera. The resulting image is scaled such that each pixel has a width corresponding to a distance on the imaged surface, which is less than half of the illumination wavelength. The number of pixels between the centers of the marks determines this distance. The locations of the marks in the image are determined and a coordinate system is defined for surfaces imaged by the digital camera. Coordinates of the beam spot in this coordinate system are also determined using the second mark.
机译:一种用于激光微加工系统的预校准方法,以实现大于照明波长衍射极限的对准公差。将毛坯安装在系统中,以使束斑入射在其顶面上。空白处有两个标记。标记的中心相距预定距离。毛坯用光照明并用数码相机成像。缩放所得图像,以使每个像素的宽度对应于被成像表面上的距离,该距离小于照明波长的一半。标记中心之间的像素数确定该距离。确定图像中标记的位置,并为数码相机成像的表面定义坐标系。光束点在该坐标系中的坐标也使用第二个标记确定。

著录项

  • 公开/公告号US2005191771A1

    专利类型

  • 公开/公告日2005-09-01

    原文格式PDF

  • 申请/专利权人 MING LI;MAKOTO ISHIZUKA;

    申请/专利号US20040790401

  • 发明设计人 MAKOTO ISHIZUKA;MING LI;

    申请日2004-03-01

  • 分类号H01L21/66;

  • 国家 US

  • 入库时间 2022-08-21 22:23:53

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