Interface Characterization of Cu-Cu and Cu-Ag-Cu Low Temperature Solid State Bonds

摘要

In this study, Auger Electron Spectroscopy (AES), Scanning Electron Microscopy (SEM) and Energy Dispersive X ray (EDX) analysis have been used to characterize the interface regions of copper to silver and copper to copper bond samples in an effort to identify those parameters which most affect the bond characteristics. Longitudinal and transverse cross sections of the bond joint are examined. Auger electron sputter depth profiling was used to examine the interface properties and composition across the bond interface. Depth profiles indicate carbon and oxygen diffuse away from the interface during bonding facilitating adhesion. Tensile tests on bonded samples indicate that bond pressure has a more significant effect on bond strength than temperature. A temperature threshold for bonding is observed which is related to the ability of the bond materials to scavenge their oxides.