Study of Natural Convection Cooling of Multiple Discrete Heat Sources in a Vertical Channel

摘要

Natural convection liquid cooling of simulated electronic components in a vertical channel was investigated. The test surface contained a single column of eight rectangular, protruding heated elements, each simulating a 20 pin dual-in-line package. Temperature measurements and flow visualization were performed for a number of power dissipation levels and channel widths. Collectively, this information was used in interpreting the flow and transport characteristics. A correlation to predict the heat transfer rates was developed, based on the component surface temperatures. Optimum channel widths were determined from these surface temperature measurements for the range of power levels investigated. Temperature distributions in the fluid were measured using a traversing thermocouple probe. Keywords include: Natural convection; Immersion cooling; Protruding heat sources; Vertical channel; and Flow visualization, Theses.