Analytical Study: Temperature Variation Across the Heated Surface of a Post with Convective Sidewall Cooling (Preprint).

摘要

Often it is desirable to cool electronic components to minimize the temperature gradient across the heat generating surface. This isothermal requirement is often required to in order to minimize thermal stresses, in the case of power electronics, or in the case of laser components, such as laser diodes, to minimize optical distortion. The objective of this analysis is to determine the effects of boundary condition(s) that will influence the steady- state temperature gradient along the top heated surface of cylindrical and rectangular posts. This is accomplished by casting the dimensionless analytical solutions in graphical form similar to Heisler-Groeber Charts. Both dimensional and dimensionless analytical solutions are presented followed by graphical presentations in dimensionless form. In this manner, the 'best' boundary conditions can be used to specify the cold plate requirements to optimally cool the electronics package. The generated dimensionless plots also allow for easy graphical determination of these boundary conditions as defined in a dimensionless form which can be readily interpreted and used to determine optimal dimensional geometries and/or thermo physical material properties to minimize temperature gradients across a heated electronic surface.