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Acoustic Wave Propagation in an Adhesive Bond Model with Degrading InterfacialLayers

机译:具有降级界面层的粘合剂键模型中的声波传播

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This report discusses analytical and numerical approaches for the theoreticalanalysis of adhesively bonded structures having various bondline quality levels. Since the adhesive strength of an adhesively bonded structure is the critical failure problem of a bond under small loads, the discussions in this paper concentrate on mathematical models which use interfacial layers between the adherend and adhesive layers as a means to show various degrees of bond quality. The analytical method discussed is a reflection coefficient calculation for multilayered structures in the frequency domain. The numerical approach used is the finite element method yielding time domain results for adhesively bonded structures having various interfacial layer conditions. Direct comparisons between the two methods are accomplished in the frequency domain, the time domain results obtained via the finite element method being appropriately Fast Fourier Transformed (FFT).... Analytical analysis, Numerical analysis, Finite element analysis, Adhesive bonding, Nondestructive evaluation, Interfacial layers, Cohesion, Adhesion.

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