Three Dimensional Transient Analysis of Microstrip Circuits in MultilayeredAnisotropic Media

摘要

In high-speed digital circuits, high frequency phenomena affects thecharacteristics of the interconnections. Physical discontinuities or nonuniformities in the connections may cause severe reflections when they can no longer by considered as conducting wires, but behave as transmission lines and/or waveguides. In multilayered digital circuits, vias constitute one of the most commonly-used class of interconnects. Vias are not good carriers of high-speed signals. They cause signal distortion and reflections as well as severe degradation in the high frequency components. The analysis and modeling of a single via and some quasi-static or quasi-TEM analyses of single via configurations have been carried out previously. To data, the analysis of coupled noise between adjacent vias has received very little attention. The major reasons include the complexity of multi-via structures and the difficulty of modeling and analyzing them accurately over a broad frequency range.