Three microstrip interconnection circuit structures of vertical via interconnection,vertical strip in-terconnection, and coupling transition between the layers are introduced and simulated for solving the prob-lem of interconnection between microstrip lines in multilayer microwave intergration circuits ( MuMICs ) . The simulation is done by using the 3D electromagnetic simulation software HFSS. The simulated result shows that the return loss ( S11 ) and insertion loss ( S21 ) of the vertical via interconnection and the vertical strip interconnection are <-20 dB and >-1 dB in 0. 1~25 GHz,repectively, showing good connection per-formance. At the same time, the return loss ( S11 ) and insertion loss ( S21 ) of the coupling transition be-tween the layers are <-20 dB and >-1 dB in 20~68 GHz,respectively,which shows this method has the potential to be used in millimeter wave bands.%针对多层微波集成电路设计的微带线层间互连问题,介绍了垂直通孔互连、垂直带条互连和层耦合过渡互连三种高性能的互连方法,并且采用三维电磁仿真软件HFSS对这三种互连结构进行了建模和仿真.仿真结果表明,垂直通孔互连和垂直带条互连在0.1~25 GHz的频宽范围内,回波损耗S11<-20 dB,插入损耗S21>-1 dB,互连性能优良,而层耦合过渡互连在20~68 GHz内回波损耗S11<-20 dB,插入损耗S21>-1 dB,具有在毫米波频段实现互连的潜力.
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