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Quantitative in-situ Kelvin probe study of boron doping in hydrogenated amorphous silicon and hydrogenated amorphous silicon carbide

机译:氢化非晶硅和氢化非晶碳化硅中硼掺杂的定量原位开尔文探针研究

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We used an in-situ Kelvin probe to study the boron doping of hydrogenated amorphous silicon (a-Si:H) and hydrogenated amorphous silicon carbide (a-SiC:H) films. Secondary-ion mass spectrometry measurements show that incorporation ratio [B]/[Si] is close to unity for both materials doped with either diborane or trimethylboron. In the case of diborane, Kelvin probe measurements indicate a higher doping efficiency in a-Si:H material than in a-SiC:H material. The variation in the contact potential of a-Si:H with the diborane concentration has been quantitatively studied and compared with the variation in the activation energy of the dark conductivity. From numerical calculations a 3 x 10(12) cm(-2) eV(-1) surface density of states, compatible with the experimental results, was found. The change in the band bending and the shift of the bulk Fermi level of a-Si:H during the doping were then deduced.
机译:我们使用原位Kelvin探针研究氢化非晶硅(a-Si:H)和氢化非晶碳化硅(a-SiC:H)薄膜的硼掺杂。二次离子质谱测量表明,掺入乙硼烷或三甲基硼的两种材料的掺入比[B] / [Si]接近于1。对于乙硼烷,开尔文探针测量表明,a-Si:H材料的掺杂效率高于a-SiC:H材料。已经定量研究了α-Si:H接触电势随乙硼烷浓度的变化,并将其与暗电导率活化能的变化进行了比较。从数值计算中,发现了3 x 10(12)cm(-2)eV(-1)的表面密度状态,与实验结果兼容。然后推导了掺杂期间a-Si:H的能带弯曲变化和体费米能级的变化。

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