...
首页> 外文期刊>Chemical vapor deposition: CVD >Silicon carbonitride films produced by remote hydrogen microwave plasma CVD using a (dimethylamino)dimethylsilane precursor
【24h】

Silicon carbonitride films produced by remote hydrogen microwave plasma CVD using a (dimethylamino)dimethylsilane precursor

机译:使用(二甲基氨基)二甲基硅烷前体通过远程氢微波等离子体CVD生产的碳氮化硅膜

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

Amorphous hydrogenated silicon carbonitride (a-Si:C:N:H) films were produced by remote microwave hydrogen plasma CVD (RP-CVD) using (dimethylamino)dimethylsilane as a single-source precursor. The reactivity of the precursor with atomic hydrogen was characterized using (dimethylamino)trimethylsilane as a model compound. The effects of the substrate temperature (T-S) on the kinetics of the RP-CVD process, and the chemical composition and structure of the resulting film, have been investigated. The temperature dependencies of the mass- and thickness-based film growth rates imply that, for a low substrate temperature range (T-S 30-100 degreesC), film growth is limited by desorption of film-forming precursors, whereas in a high substrate temperature range (T-S 100-400 degreesC) film growth is independent of the temperature, and the rate of RP-CVD is mass-transport limited. The increase of the substrate temperature from 30 degreesC to 400 degreesC causes the elimination of organic moieties from the film and the formation of a Si-N and Si-C network structure. The films produced at T-S = 300 degreesC were found to be dense materials exhibiting excellent morphological homogeneity, high hardness, and an extremely low friction coefficient. In view of these properties, a-Si:C:N:H films produced by RP-CVD seem to be promising coatings for tribological use.
机译:使用(二甲基氨基)二甲基硅烷作为单源前驱体,通过远程微波氢等离子体CVD(RP-CVD)生产非晶态氢化碳氮化硅(a-Si:C:N:H)膜。使用(二甲基氨基)三甲基硅烷作为模型化合物表征了前体与原子氢的反应性。研究了衬底温度(T-S)对RP-CVD工艺动力学以及所得膜的化学组成和结构的影响。基于质量和厚度的膜生长速率的温度相关性意味着,对于较低的基板温度范围(TS 30-100摄氏度),膜生长受到成膜前体的解吸的限制,而在较高的基板温度范围内(TS 100-400摄氏度)膜的生长与温度无关,并且RP-CVD的速率受到质量传输的限制。基板温度从30℃增加到400℃会导致薄膜中有机部分的消除,并形成Si-N和Si-C网络结构。发现在T-S = 300℃下生产的膜是致密材料,其表现出优异的形态均匀性,高硬度和极低的摩擦系数。考虑到这些性质,通过RP-CVD生产的a-Si:C:N:H膜似乎是摩擦学应用中很有希望的涂层。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号