Approach on Thermal Strain Behaviour of PBGA Solder Joints

摘要

The aim of this study was to provide a systematic method to analyse and test the thermal strain behaviour of plastic ball grid array (PBGA) solder joints in electronic packaging. Based on the structural, thermal and physical properties of the PBGA sample, the thermal strain test was developed to measure the strain distribution at the surface of the bismaleimide triazin (BT) substrates and the printed circuit board (PCB) surface under thermal cycling, at the temperature range of 0 to 100℃. The experimental results show that the changing trends of strain in the BT and PCB surfaces were approximately the same during the thermal cycling. Comparison between the experimental results and simulation illustrates the validity of the experimental test and finite element modelling results. It builds a basis for future work for evaluating the design and reliability of the BGA packaging.