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Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue

机译：Sn pb焊点热疲劳过程中循环应力-应变行为的数值模拟

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作者
Mohd Nasir Tamin; Liew Yek Ban;
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年度 2008
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原文格式 PDF
正文语种 {"code":"en","name":"English","id":9}
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1. Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue [J] . VIANCO P.T., BURCHETT S.N., NEILSEN M.K., Journal of Electronic Materials . 1999,第11期

机译：基于本构模型的焊点热机械疲劳预测中的Sn-Pb焊料微观结构的粗化
2. Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue [J] . P.T. VIANCO, S.N. BURCHETT, M.K. NEILSEN Journal of Electronic Materials . 1999,第11期

机译：基于本构模型的焊点热机械疲劳预测中的Sn-Pb焊料微观结构的粗化
3. Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursions [J] . K. N. SUBRAMANIAN Fatigue & Fracture of Engineering Materials & Structures . 2007,第5期

机译：锡的各向异性行为对热偏移下锡基焊点热机械疲劳和断裂的作用
4. Computer modeling of isothermal low-cycle fatigue of Pb-Sn solder joints [C] . Zhenfeng Guo, Conrad, H. Electronic Components and Technology Conference, 1993. Proceedings., 43rd . 1993

机译：Pb-Sn焊点等温低周疲劳的计算机建模
5. Macrocrack formation model with application to the fatigue of 63Sn-37Pb solder (Tin-lead solder). [D] . Stolkarts, Vladimir. 1999

机译：宏观裂纹形成模型及其在63Sn-37Pb焊料（锡铅焊料）疲劳中的应用。
6. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena mechanism and prevention [O] . M. Y. Li, H. F. Yang, Z. H. Zhang, -1

机译：超声波辅助钎焊在Mg / Sn基钎料/ Mg接头中快速形成和生长高密度锡晶须：现象机理和预防方法
7. Numerical modeling of cyclic stress-strain behaviorudOf sn-pb solder joint during thermal fatigueud [O] . Tamin M N, Liew Y B 2005

机译：循环应力应变行为的数值模拟 ud热疲劳过程中锡铅焊点的 ud

Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue

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