Manufacturing of aluminum nitride heat exchangers by ceramic injection molding

摘要

AlN ceramics are known for their wide range of applications in electronics mainly as substrate materials for semiconductor ICs in computer applications, optical components (heatsinks for laser diodes) and high performance hot gas/water heat exchangers because of their advantageous thermophysical properties. Conventional heat exchangers made of steel and copper widely used in thermal value heating systems are less efficient and less reliable than polycrystalline AlN, heat exchangers, doped with Y{sub}2O{sub}3 for better corrosion resistance, due to their inferior thermal conductivity (20 W/mK) and long term corrosion problems based on condensation products from the vapour phase forming dilute acids. AlN ceramics are most commonly manufactured via axial and cold isostatic pressing. The advantage of injection molding is based on the high efficiency, process stability and materials economy resulting in low specific cost for mass production of an advanced ceramic component with complex net shape and performing surface quality.