AlN ceramics are known for their wide range of applications in electronics mainly as substrate materials for semiconductor ICs in computer applications, optical components (heatsinks for laser diodes) and high performance hot gas/water heat exchangers because of their advantageous thermophysical properties. Conventional heat exchangers made of steel and copper widely used in thermal value heating systems are less efficient and less reliable than polycrystalline AlN, heat exchangers, doped with Y_2O_3 for better corrosion resistance, due to their inferior thermal conductivity (20 W/mK) and long term corrosion problems based on condensation products from the vapour phase forming dilute acids. AlN ceramics are most commonly manufactured via axial and cold isostatic pressing. The advantage of injection molding is based on the high efficiency, process stability and materials economy resulting in low specific cost for mass production of an advanced ceramic component with complex net shape and performing surface quality.
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机译：ALN陶瓷以其广泛的电子产品应用主要是计算机应用中的半导体IC的基材，光学元件（用于激光二极管的散热）和高性能热气体/水热交换器，因为它们有利的热物理性质。由钢和铜制成的常规热交换器广泛用于热值加热系统的效率低，比多晶AlN，热交换器更低，掺杂有Y_2O_3，以更好地耐腐蚀性，由于它们的劣势导热性（20 W / MK）和长基于来自气相形成稀酸的缩合产物的术语腐蚀问题。 ALN陶瓷最常通过轴向和冷等静压而制造。注塑成型的优点是基于高效率，工艺稳定性和材料经济性，导致批量生产具有复杂净形状的先进陶瓷部件和性表面质量的低特定成本。
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