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Nickel containing diamond like carbon thin films

机译:含镍的类金刚石碳薄膜

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Diamond like carbon (DLC) coatings are well established for multiple applications. The electrical conductivity of DLC or amorphous carbon can be influenced by several orders of magnitude via doping with different metals. Depending on the deposition process hydrogen may be incorporated as well, thereby decreasing the conductivity. Recent investigations of DLC disclose nice piezoresistive properties. Our work was focused on Ni:a-C:H thin films on different substrates by reactive sputtering from a nickel target Several carbon precursors were added to the sputtering gas to create an amorphous carbon hydrogen network with embedded crystal clusters. In order to optimize the piezoresistive properties we varied various process parameters. The piezoresistive response was monitored by measuring the resistance change during bending. Our Ni:a-C:H films develop gauge factors of approx. 12 in a wide range of process parameters. For sensor applications the temperature coefficient of resistance (TCR) is important as well. It depends on the metal concentration in the thin film and can be adjusted by the concentration of the incorporated nickel. It can be set to approximately zero in a wide temperature range of 80-400 K. The combination of a high gauge factor and a very small TCR is achieved and described in this paper. XRD measurements reveal nickel or nickel carbide clusters with diameters of approx. 8-30 nm depending on the metal concentration. The clusters crystallize in the hexagonal hcp structure which could be transformed into the cubic fcc structure of nickel by thermal annealing in a vacuum.
机译:类金刚石碳(DLC)涂层已经很好地用于多种应用。通过掺杂不同的金属,DLC或非晶碳的电导率会受到几个数量级的影响。根据沉积工艺,也可以掺入氢,从而降低电导率。 DLC的最新研究揭示了良好的压阻特性。我们的工作集中在通过镍靶的反应溅射在不同基板上的Ni:a-C:H薄膜上。将几种碳前体添加到溅射气体中,以创建具有嵌入式晶体簇的非晶碳氢网络。为了优化压阻特性,我们改变了各种工艺参数。通过测量弯曲过程中的电阻变化来监控压阻响应。我们的Ni:a-C:H薄膜的规格因子约为。 12种广泛的工艺参数。对于传感器应用,电阻温度系数(TCR)也很重要。它取决于薄膜中金属的浓度,可以通过掺入的镍的浓度进行调节。可以在80-400 K的宽温度范围内将其设置为近似零。本文实现并描述了高规格系数和非常小的TCR的组合。 XRD测量显示直径大约为10毫米的镍或碳化镍簇。 8-30 nm,取决于金属浓度。团簇以六方晶hcp结构结晶,可通过在真空中进行热退火将其转变为镍的立方fcc结构。

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