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Thermomechanical and shape-memory properties of epoxy-based shape-memory polymer using diglycidyl ether of ethoxylated bisphenol-A

机译:使用乙氧基化双酚A的二缩水甘油醚的环氧基记忆聚合物的热力学和形状记忆特性

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摘要

A series of epoxy-based shape-memory polymers (SMPs) was prepared by using diglycidyl ether of ethoxylated bisphenol-A containing two oxyethylene units and the curing agents iso-phorone diamine and Jeffamine D230. The thermal properties, dynamic mechanical properties, mechanical properties and shape-memory properties of the epoxy-based SMPs were systematically studied by DSC, DMTA, universal tester and fold-deploy experiments, respectively. The results showed that as the content of D230 increased, the glass transition temperature of the SMPs decreased from 77.5 ± 1.1 to 40 ± 0.7 °C according to DSC, the rubber modulus decreased gradually according to DMTA, and the tensile strength at room temperature (RT) decreased from 58.5 ± 0.3 to 27.0 ± 3.3 MPa according to tensile tests. Tensile tests above RT showed that the tensile stress and elongation at break depended heavily on the experimental temperature, and fold-deploy experiments showed that these SMPs had shape retention ratios higher than 95% and shape recovery ratios close to 100%.
机译:通过使用含有两个氧化乙烯单元的乙氧基化双酚A的二缩水甘油醚和固化剂异佛尔酮二胺和Jeffamine D230,制备了一系列基于环氧的形状记忆聚合物(SMP)。通过DSC,DMTA,通用测试仪和折叠展开实验分别系统地研究了环氧基SMP的热性能,动态力学性能,力学性能和形状记忆性能。结果表明,随着D230含量的增加,SMP的玻璃化转变温度根据DSC从77.5±1.1降至40±0.7°C,根据DMTA橡胶模量逐渐降低,并且室温下的拉伸强度(根据拉伸试验,RT)从58.5±0.3 MPa降低至27.0±3.3 MPa。在室温以上的拉伸试验表明,拉伸应力和断裂伸长率很大程度上取决于实验温度,而折叠试验表明,这些SMP的形状保持率高于95%,形状恢复率接近100%。

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