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Epoxy-Based Shape-Memory Actuators Obtained via Dual-Curing of Off-Stoichiometric Thiol–Epoxy Mixtures

机译:通过对非化学计量的硫醇-环氧混合物进行双重固化获得基于环氧树脂的形状记忆致动器

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摘要

In this work, epoxy-based shape-memory actuators have been developed by taking advantage of the sequential dual-curing of off-stoichiometric “thiol–epoxy” systems. Bent-shaped designs for flexural actuation were obtained thanks to the easy processing of these materials in the intermediate stage (after the first curing process), and successfully fixed through the second curing process. The samples were programmed into a flat temporary-shape and the recovery-process was analyzed in unconstrained, partially-constrained and fully-constrained conditions using a dynamic mechanical analyzer (DMA). Different “thiol–epoxy” systems and off-stoichiometric ratios were used to analyze the effect of the network structure on the actuation performance. The results evidenced the possibility to take advantage of the flexural recovery as a potential actuator, the operation of which can be modulated by changing the network structure and properties of the material. Under unconstrained-recovery conditions, faster and narrower recovery-processes (an average speed up to 80%/min) are attained by using materials with homogeneous network structure, while in partially- or fully-constrained conditions, a higher crosslinking density and the presence of crosslinks of higher functionality lead to a higher amount of energy released during the recovery-process, thus, increasing the work or the force released. Finally, an easy approach for the prediction of the work released by the shape-memory actuator has been proposed.
机译:在这项工作中,通过利用非化学计量的“硫醇-环氧”系统的顺序双重固化,开发了基于环氧树脂的形状记忆执行器。由于这些材料在中间阶段(在第一次固化过程之后)易于加工,因此获得了用于弯曲驱动的弯曲形设计,并在第二次固化过程中成功固定。将样品编程为平坦的临时形状,并使用动态机械分析仪(DMA)在无约束,部分约束和完全约束的条件下分析恢复过程。使用不同的“硫醇-环氧”系统和化学计量比失调的方法来分析网络结构对驱动性能的影响。结果证明了利用挠曲恢复作为潜在致动器的可能性,该挠性恢复的操作可以通过改变材料的网络结构和性质来调节。在不受约束的回收条件下,通过使用具有均匀网络结构的材料,可以实现更快,更窄的回收过程(平均速度高达80%/ min),而在部分或完全约束的条件下,可以实现更高的交联密度和存在较高官能度的交联导致回收过程中释放的能量更多,从而增加了功或释放的力。最后,提出了一种简单的方法来预测形状记忆执行器释放的功。

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