Process Development of Integrated Vcom and PAS using Wet Etching Bias Control for High Resolution UHD AH-IPS TFT-LCD

摘要

We introduce new structure to reduce number of Masks in the TFT-LCD manufacturing process. When Vcom is etched by passivation pattern, etching bias is made under the passivation. We controlled bias size by changing the substrate material under Vcom. So, we could make two patterns using only one Mask.