Lifetime Measurement and Reliability upon Storage of Thin-Film Encapsulated PIN OLED

摘要

A multilayer thin-film encapsulation process based on the use of Atomic Layer Deposition of Al_2O_3 for organic light-emitting diodes (OLED) has been developed at LETI. Its impact onto OLED characteristics and onto the lifetime degradation of devices has been studied. The degradation model has been compared to the usual model of glass-encapsulated OLED and the performances of the thin-film encapsulation has been evaluated upon storage in 65℃/85%RH conditions.