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THIN-FILM ENCAPSULATED OLED DEVICE AND THIN FILM ENCAPSULATION METHOD FOR OLED DEVICE
THIN-FILM ENCAPSULATED OLED DEVICE AND THIN FILM ENCAPSULATION METHOD FOR OLED DEVICE
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机译:薄膜封装的OLED装置及用于OLED装置的薄膜封装方法
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摘要
A thin-film encapsulated organic light-emitting diode (OLED) device and a thin-film encapsulation method for an OLED device, comprising: an OLED display device and at least one encapsulation structure encapsulated on the OLED display device, wherein the encapsulation structure comprises: a first inorganic encapsulation layer (210), which is made of a water-resistant inorganic material; an organic scattering layer (220) which is arranged on the first inorganic encapsulation layer (210), the organic scattering layer (220) being used for improving optical coupling output of the OLED display device; a second inorganic encapsulation layer (230) which is arranged on the organic scattering layer (220), the second inorganic encapsulation layer (230) being made of a water-resistant inorganic material. Providing an inorganic water-resistant encapsulation layer and an organic scattering layer on an OLED display device may ensure that the OLED device is provided with sufficient water and oxygen resistant capabilities while having a relatively high optical coupling output.
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