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首页> 外文期刊>SID International Symposium: Digest of Technology Papers >Top-Gate and Bottom-Gate Amorphous ZnO Transparent TFTs Fabricated by All-Etching Processes
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Top-Gate and Bottom-Gate Amorphous ZnO Transparent TFTs Fabricated by All-Etching Processes

机译:通过全蚀刻工艺制造的顶栅和底栅非晶ZnO透明TFT

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摘要

Both top-gate and bottom-gate amorphous ZnO TTFTs were effectively fabricated by thinning the ZnO layer and by using all-etching processes. Rather high field-effect mobilities of 25 cm{sup}2/Vs and 4 cm{sup}2/Vs and on/off current ratios of >10{sup}7 and >10{sup}6 were achieved for top-gate and bottom-gate configurations, respectively.
机译:通过使ZnO层变薄并使用全蚀刻工艺,可以有效地制造顶栅和底栅非晶ZnO TTFT。顶栅的场效应迁移率相当高,分别为25 cm {sup} 2 / Vs和4 cm {sup} 2 / Vs,开/关电流比> 10 {sup} 7和> 10 {sup} 6和底栅配置。

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