Large Scale Arrays of Microeavsty Plasma Devices Based on Encapsulated Al/Al{sub}2O{sub}3 Electrodes: Device Characteristics as a Plasma Display Pixel and Low Cost Wet Chemical Fabrication Processing

摘要

Addressable, large scale arrays of microcavity plasma devices have been fabricated by wet chemical processes. Dielectric encapsulated aluminum microcavity electrodes having cavities with a diameter of 100-200 μm are formed by wet electrochemical process suitable for low cost manufacturing. This presentation reports device structure and cell designs for high pressure Xe microplasmas.