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Enhancement in Positive Bias Stress Stability of In-Ga-Zn-O Thin-Film Transistors with Vertically Graded-Oxygen-Vacancy Active Layer

机译:具有垂直渐变的氧空位有源层的In-Ga-Zn-O薄膜晶体管的正偏置应力稳定性的增强

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摘要

To enhance the bias stability of amorphous indium gallium zinc oxide (a-IGZO) thin-film transistors (TFTs), we proposed a simple method to deposit the vertically graded-oxygen-vacancy active layer (VGA). The oxygen partial pressure was varied during deposition in order to fabricate VGA TFTs using sputtering. By adopting this method, we could control the concentration of oxygen vacancy in active layer according to the depth. The threshold voltage shift of optimized VGA TFTs was drastically improved under positive bias stress (PBS) condition compared with conventional ones.
机译:为了增强非晶铟镓锌氧化物(a-IGZO)薄膜晶体管(TFT)的偏压稳定性,我们提出了一种简单的方法来沉积垂直渐变的氧空位有源层(VGA)。在沉积过程中改变氧分压以便使用溅射来制造VGA TFT。通过采用这种方法,我们可以根据深度控制活性层中氧空位的浓度。与传统的VGA TFT相比,在正偏压(PBS)条件下,优化的VGA TFT的阈值电压漂移得到了极大的改善。

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