首页> 外国专利> OXIDE FOR SEMICONDUCTOR LAYER OF THIN-FILM TRANSISTOR, SEMICONDUCTOR LAYER OF THIN-FILM TRANSISTOR HAVING SAID OXIDE, AND THIN-FILM TRANSISTOR

OXIDE FOR SEMICONDUCTOR LAYER OF THIN-FILM TRANSISTOR, SEMICONDUCTOR LAYER OF THIN-FILM TRANSISTOR HAVING SAID OXIDE, AND THIN-FILM TRANSISTOR

机译:用于薄膜晶体管的半导体层的氧化物,具有所述氧化物的薄膜晶体管的半导体层和薄膜晶体管

摘要

The oxide of the present invention for thin-film transistors is an In—Zn—Sn-based oxide containing In, Zn, and Sn, wherein when the respective contents (atomic %) of metal elements contained in the In—Zn—Sn-based oxide are expressed by [Zn], [Sn], and [In], the In—Zn—Sn-based oxide fulfills the following expressions (2) and (4) when [In]/([In]+[Sn])≦0.5; or the following expressions (1), (3), and (4) when [In]/([In]+[Sn])0.5. [In]/([In]+[Zn]+[Sn])≦0.3 - - - (1), [In]/([In]+[Zn]+[Sn])≦1.4×{[Zn]/([Zn]+[Sn])}−0.5 - - - (2), [Zn]/([In]+[Zn]+[Sn])≦0.83 - - - (3), and 0.1≦[In]/([In]+[Zn]+[Sn]) - - - (4). According to the present invention, oxide thin films for thin-film transistors can be obtained, which provide TFTs with excellent switching characteristics, and which have high sputtering rate in the sputtering and properly controlled etching rate in the wet etching.
机译:用于本发明的薄膜晶体管的氧化物是包含In,Zn和Sn的In-Zn-Sn基氧化物,其中当In-Zn-Sn-中包含的金属元素的各自含量(原子%)时,基氧化物由[Zn],[Sn]和[In]表示,当[In] /([In] + [Sn]时,In-Zn-Sn基氧化物满足以下表达式(2)和(4) ])≦0.5;当[In] /([In] + [Sn])> 0.5时,可以使用以下表达式(1),(3)和(4)。 [In] /([In] + [Zn] + [Sn])≤0.3---(1),[In] /([In] + [Zn] + [Sn])≤1.4×{[Zn] /([[Zn]+[Sn])}-0.5---(2),[Zn] /([In] + [Zn] + [Sn])≤0.83---(3),0.1≤[ In] /([In] + [Zn] + [Sn])---(4)。根据本发明,可以获得用于薄膜晶体管的氧化物薄膜,其提供具有优异的开关特性的TFT,并且在溅射中具有高溅射速率,并且在湿法蚀刻中具有适当控制的蚀刻速率。

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