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An uncooled microbolometer infrared detector based on poly-SiGe thermistor

机译:基于多晶硅SiGe热敏电阻的非制冷微辐射热计红外探测器

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This paper reports an uncooled microbolometer infrared detector with polycrystalline silicon-germanium thermistor as the active element. Polycrystalline silicon-germanium (poly-SiGe) films are deposited by ultrahigh vacuum vapor deposition (UHV/CVD) and their structural properties are characterized by Rutherford backscattering spectrometry (RBS), SEM and Raman spectrum. The dependency of the temperature coefficient of resistance on operating temperature and on annealing temperature has been investigated. The complete fabrication of the microbolometer is described. To decrease the thermal conductance of the microbolometer, a poly-SiGe thermistor is formed on a two/four leg suspended microbridge with bulk silicon anisotropic etching and induced couple plasma (ICP) technique. Measurements and calculations show that at a bias voltage of 5 V, the maximum detectivity of 8.3 x 10(8) cm Hz(1/2)/W is achieved at 15 Hz with a thermal response time of 16.6 ms. At a chopper frequency of 30 Hz, the maximum detectivity of 7.48 x 10(8) cm Hz(1/2)/W and approximately 86% of the maximum responsivity are reached at 12.5 V, respectively. (C) 2003 Elsevier B.V. All rights reserved. [References: 15]
机译:本文报道了一种以多晶硅-锗热敏电阻为有源元件的非制冷微辐射热计红外探测器。通过超高真空气相沉积(UHV / CVD)沉积多晶硅锗(poly-SiGe)膜,并通过卢瑟福背散射光谱(RBS),SEM和拉曼光谱表征其结构特性。已经研究了电阻温度系数对工作温度和退火温度的依赖性。描述了微辐射热计的完整制造。为了降低测微辐射热计的热导率,采用大块硅各向异性蚀刻和感应耦合等离子体(ICP)技术,在两脚/四脚悬挂微桥上形成了一个多晶硅SiGe热敏电阻。测量和计算表明,在5 V的偏置电压下,在15 Hz时具有16.6 ms的热响应时间,可以实现8.3 x 10(8)cm Hz(1/2)/ W的最大检测率。在斩波器频率为30 Hz时,在12.5 V时分别达到7.48 x 10(8)cm Hz(1/2)/ W的最大检测率和大约86%的最大响应率。 (C)2003 Elsevier B.V.保留所有权利。 [参考:15]

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