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Highly programmable temperature compensated readout circuit for capacitive microaccelerometer

机译:电容式微加速度计的高度可编程温度补偿读出电路

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This paper describes a capacitive microaccelerometer system and readout circuit topology with a high programmability and a low temperature dependency. The MEMS sensing element is fabricated using the Sacrificial Bulk Micromachining (SBM) process and the Wafer Level Hermetic Packaging (WLHP) process, to achieve high reliability, low noise and low bias instability. The readout circuit exploits a highly programmable capacitive sensing architecture with an on-chip EEPROM in order to calibrate the output offset and the scale factor. The temperature compensated sub-circuits, including a bandgap reference, a current reference, and an oscillator, are designed to enhance the temperature characteristics. The supply voltage variations are compensated for by using an on-chip voltage regulator. The reverse voltage protection circuit is also designed to enhance the electrical reliability. After calibrating the scale factor and the offset by using the programmable circuits, the scale factor error and the offset error are compensated to 1.2%FSO and 3.3%FSO, respectively. The temperature coefficient of the offset is measured to be 43 ppm/C in the temperature range from 40 C to 125 C. The bias instability and the noise equivalent resolution are measured to be in the range from 16.1g to 135.2g, and from 93.5g/√Hz to 514.0g/√Hz, respectively.
机译:本文介绍了一种具有高可编程性和低温度依赖性的电容式微加速度计系统和读出电路拓扑。 MEMS传感元件采用牺牲体微机械加工(SBM)和晶圆级气密封装(WLHP)工艺制造,以实现高可靠性,低噪声和低偏置不稳定性。读出电路利用具有片上EEPROM的高度可编程电容感测架构,以校准输出失调和比例因子。温度补偿子电路(包括带隙基准,电流基准和振荡器)旨在增强温度特性。通过使用片上稳压器可以补偿电源电压的变化。反向电压保护电路还旨在提高电气可靠性。通过使用可编程电路对比例因子和失调进行校准后,比例因子误差和失调误差分别补偿为1.2%FSO和3.3%FSO。在40 C至125 C的温度范围内,偏移的温度系数测得为43 ppm / C。偏置不稳定性和噪声等效分辨率的测得范围为16.1g至135.2g,以及93.5。 g /√Hz分别为514.0g /√Hz。

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