The role of grain boundary plane orientation on intergranular corrosion of symmetric and asymmetric [110] tilt grain boundaries in directionally solidified pure copper

摘要

Susceptibility to intergranular corrosion of asymmetric grain boundaries in pure copper was well correlated with a geometric criteria, i.e. the effective interplanar spacing of grain boundaries rather than coincidence site lattice (CSL) scheme if we rationally assume that the grain boundary structure relaxes to be formed by low-index planes, therefore resulting in high interplanar spacing.