Anisotropy of grain boundary energies as cause of abnormal grain growth in electroplated copper films

摘要

The dihedral angle distribution of electroplated (EP) Cu films is significantly broader than those of vapor-deposited films, which may indicate anisotropy of the grain boundary energies. Additives incorporated during EP are presumed to cause anisotropy in the grain boundary energy and abnormal grain growth during self-annealing.